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Analysis of the Density of Electron-Hole Pairs for Minimal Pump Energy in a Laser Diode with Coherent Feedback
Density of electron-hole pairs laser diode coherent feedback minimal pump energy
2010/12/9
The average value in the time domain of the density of electron-hole pairs in a semiconductor laser with coherent feedback is calculated under conditions of minimal pump energy. This value is found to...
A Discussion on the Phonon Density of States of Amorphous Germanium for the Infrared Range
Phonon density of states amorphous germanium infrared range quasiharmonic approximation
2010/12/10
A theoretical formulation for the phonon density of states of amorphous germanium in the infrared range is proposed. This formulation is based upon the quasi-harmonic approximation and is compared wit...
Bondig technique developed by CII-Honeywell Bull. The paper describes the geometry of bonding pads at the chip level, the design and realization of the corresponding high density 35 mm tape and the in...
A chip and wire, high density packaging approach has resulted in a low cost, large scale, high density, multi-chip package (MCP). The package includes 76 ICs, 1 resistor, and 34 capacitor chips on a 2...
Tape Automated Bonding for High Density Packaging
Tape Automated Bonding High Density Packaging
2011/1/5
High density packaging of semiconductor devices is necessary for high performance in compact electronic systems. But the assembly technology must also remain cost attractive.
Through the development ...