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As CMOS 160Mb/s Phase Modulation I/O Interface Circuit
CMOS Phase Modulation I/O Interface Circuit
2015/8/14
As CMOS 160Mb/s Phase Modulation I/O Interface Circuit.
Asynchronous interface ASIC Flow (RTL-to-GDSII) using cadence and synopsys Tools
Semiconductor devices traffic congestion the design process
2014/12/31
As the technology sizes of semiconductor devices continue to decrease, the effect of nanometer technologies on congestion, signal integrity, crosstalk etc. are becoming more significant. These all fac...
VIRTEX 4 LX200 automated temperature stress test serial interface and test control logic design implementation
Automatic test hot chamber temperature pressure equipment temperature
2014/12/31
The overall project is to create a system that automatically tests the internal components of Xilinx Virtex 4 LX200 device, while the device is running in a thermal chamber at temperatures that stress...
Aircraft artificial horizon with interface to 3D Android application
Six axis spacecraft attitude indicator the operating system microprocessor tools mixer
2014/12/31
The goal of this project is to provide a 6-axis Aircraft Attitude Indicator solution based on Android OS and cutting edge MPU-6000 chip by Invensense. Mentor Graphics emerging Inflexion UI technology ...
Pressure dependence of electron-IO-phonon interaction in multi-interface heterostructure systems
2007/7/28
期刊信息
篇名
Pressure dependence of electron-IO-phonon interaction in multi-interface heterostructure systems
语种
英文
撰写或编译
撰写
作者
闫祖威1,2,班士良2,梁希侠2
第一作者单位
1 内蒙古农业大学理学院；2 内蒙古大学理工学院
刊物名称
Int. J. of Mod. Phys. B...
Modeling of Interface Defect Distribution for an n-MOSFETs Under Hot-Carrier Stressing
n-MOSFET Defects Stress Hot-carrier Aging
2010/12/8
We propose to model the evolution of the interface defect density, induced by the hot-carrier-injection, during stress time for n-MOSFET transistor. This interface defect density is modeled by a spati...
The Influence of Load Pressure on Properties of Wafer-Bonding Interface
Wafer bonding load pressure the optical and electrical quality interface
2010/7/15
Wafer bonding offers a new degree of freedom to integrate mismatched materials while maintaining high optical and electrical quality interfaces. The electrical and optical characteristics of the wafer...
Surface Recombination Via Interface Defects in Field Effect Transistors
Recombination current oxide semiconductor energy level
2010/12/10
Recombination current at the oxide-semiconductor interface of metal-oxide-semiconductor devices has been analyzed and compared with the experimental result. The activity of interface traps is dependen...